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Shown on this page are some of the single-chip, transceiver modules that were developed to analyze and characterize the performance of the chip. Test data was use to help verify the chip designers simulation results. |
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 (click photo to enlarge) |
Top side of a four layer evaluation board for a single-chip GSM/DCS cellular telephone front end. This circuit board includes all the necessary circuits to allow for complete port to port functional and parametric testing. This module interfaces to the baseband signal processor and controller to make a complete GSM and DSC cell phone. | ||||||||||||
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Bottom side of the single-chip GSM/DCS cellular telephone evaluation board. This board is assembled with predominately 0402 size discrete components. This layout technique uses end-launch SMA connectors. This view shows the TCXO, two VCOs, baluns, and various other components. | ||||||||||||
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(click photo to enlarge) |
This evaluation board was designed for another client using a more rigid, aluminum frame, to hold the flange-mount SMA connectors. This technique was chosen because of the BGA packaged single-chip GSM/DCS chip needs a very stable circuit board surface.
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Bottom view of the aluminum frame used to hold the SMA connectors on the single-chip GSM/DCS evaluation board. The aluminum frame also improves the accuracy of de-embedded RF data. We have a number of standard frame sizes and styles that can fit a variety of evaluation board configurations. |
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